همایش ، رویداد ، ژورنال
اینستاگرام تی پی بین
حوزه های تحت پوشش رویداد
  • site-selective electroless plating of copper on a poly(ethylene terephthalate) surface modified with a self-assembled monolayer

    جزئیات بیشتر مقاله
    • تاریخ ارائه: 1392/07/24
    • تاریخ انتشار در تی پی بین: 1392/07/24
    • تعداد بازدید: 1051
    • تعداد پرسش و پاسخ ها: 0
    • شماره تماس دبیرخانه رویداد: -
     a technique to obtain the site-selective electroless deposition of copper on poly(ethylene terephthalate) substrates was studied in our research. the substrates were first treated with ultraviolet light. then, on the surfaces of the substrates, self-assembled monolayers were grafted. the self-assembled monolayers were further modified by vacuum ultraviolet irradiation through a photomask, thus forming regions with different functional groups. copper finally deposited on the specifical regions. as confirmed by scanning electron microscopy (sem), atomic force microscopy (afm) and x-ray photoelectron spectroscopy (xps), the copper micropatterning possessed excellent selectivity and high fidelity. the feature size of copper micropatterning was approximately 2 μm and the diameter of copper particles was in the range of 50–100 nm.

سوال خود را در مورد این مقاله مطرح نمایید :

با انتخاب دکمه ثبت پرسش، موافقت خود را با قوانین انتشار محتوا در وبسایت تی پی بین اعلام می کنم
مقالات جدیدترین رویدادها
مقالات جدیدترین ژورنال ها