• development of high strength, high conductivity copper by friction stir processing

    نویسندگان :
    جزئیات بیشتر مقاله
    • تاریخ ارائه: 1390/01/01
    • تاریخ انتشار در تی پی بین: 1390/01/01
    • تعداد بازدید: 425
    • تعداد پرسش و پاسخ ها: 0
    • شماره تماس دبیرخانه رویداد: -
     the objective of this study is to obtain a high strength, high conductivity copper by friction stir processing. three milli meter thick pure copper plate was friction stir processed to a depth of 2.8 mm at low-heat input conditions by varying the travel speed from 50 to 250 mm/min at a constant rotation speed (300 rpm) to obtain fine grains. grain size of the nugget decreased from 9 to 3 μm and the hardness increased from 102 to 114 hv by increasing the traverse speed from 50 to 250 mm/min. yield strength, microhardness and ultimate tensile strength increased with decrease in grain size in the nugget region and the yield strength obeyed σs = 223.8 + 0.07d−1/2 hall–petch relationship, where d is the grain size in m. electrical resistivity measurement at room temperature showed that there was no change in the resistivity of the processed samples compared to the base metal.

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