• transformation-induced plasticity in sn-in solder joints

    جزئیات بیشتر مقاله
    • تاریخ ارائه: 1392/07/24
    • تاریخ انتشار در تی پی بین: 1392/07/24
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     the research reported here concerns the contribution of transformation- induced plasticity (trip) to the shear deformation of sn-x wt.%in solders with cu or ni metallization, where the in content (x) ranges from 9 wt.% to 15 wt.%. in this concentration range the high-temperature γ-phase (hexagonal structure) transforms to the low-temperature β-phase (β-sn structure) on cooling, and the transformation can be martensitic. the results show that sn-9in and sn-11in solder joints do exhibit trip that significantly enhances their ductility when tested at temperatures between the deformation-induced martensite temperature (m d) and the stress-induced martensite temperature (my). for sn-9in, m d ≈ 105°c, and the trip effect is optimal near m y ≈ 80°c, where the total elongation reaches ~100% when the substrate metallization is cu. the trip elongation is less spectacular with ni metallization because of weakness at the solder–substrate interface. sn-11 wt.%in joints also show extensive trip effect, with an m d temperature near 60°c, and an m y of 35°c or less. the total elongation of 11 wt.% in joints on cu reaches 350% at 35°c. sn-15 wt.%in joints with cu metallization also have excellent ductility at low temperature, with total elongation of ~50% at 35°c. in this case, however, the excellent ductility is due to the fine-grained, two-phase microstructure of the solder rather than any trip effect.

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